Product categories
Intel® Server System D50TNP2MHSTAC Storage Module
| Essentials | |
| Product Collection | Intel® Server D50TNP Family |
| Chassis Form Factor | 2U Rack |
| Compatible Product Series | 3rd Generation Intel® Xeon® Scalable Processors |
| Socket | Socket-P4 |
| TDP | 205 W |
| Board Chipset | Intel® C621A Chipset |
| Target Market | High Performance Computing |
Intel® Server System D50TNP2MHSTAC Storage Module
| Essentials | |
| Product Collection | Intel® Server D50TNP Family |
| Code Name | Products formerly Tennessee Pass |
| Marketing Status | Launched |
| Launch Date | Q3'21 |
| Expected Discontinuance | 2023 |
| EOL Announce | Friday | May 5 | 2023 |
| Last Order | Friday | June 30 | 2023 |
| Limited 3-year Warranty | Yes |
| Extended Warranty Available for Purchase (Select Countries) | Yes |
| Additional Extended Warranty Details | Dual Processor Board Extended Warranty |
| Compatible Product Series | 3rd Generation Intel® Xeon® Scalable Processors |
| Board Form Factor | 8.33” x 21.5” |
| Chassis Form Factor | 2U Rack |
| Socket | Socket-P4 |
| Integrated BMC with IPMI | IPMI 2.0 & Redfish |
| Rack-Friendly Board | Yes |
| TDP | 205 W |
| Included Items | (1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K74857 (1) 1U storage module air duct right – iPN K88592 (1) 1U storage module air duct left – iPN K88590 (2) 1U riser bracket to support TNP1URISER – iPN K25206 (2) M.2 heat sink assembly TNPM2HS (1) 1U Air-Cooled front Heat Sink TNP1UHSF (1) 1U Air-Cooled Rear Heat Sink TNP1UHSB (2) Processor clip | for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) Storage Compute Module Docking Board TNPSTDCKBRD (2) OCuLink cable 520 mm – iPN K73563 (2) OCuLink cable 125 mm – iPN K73567 (2) OCuLink cable 145 mm – iPN K73568 (2) OCuLink cable 140 mm – iPN K73570 (1 each) OCuLink connector covers for J25 | J26 | J29 | and J30 – iPN K74231 (1 each) OCuLink connector covers for J27 and J28 – iPN K74230 |
| Board Chipset | Intel® C621A Chipset |
| Target Market | High Performance Computing |
| Supplemental Information | |
| Embedded Options Available | No |
| Description | A 2U high-density Storage module integrated with the Intel® Server Board D50TNP1SB intended for dense and fast storage solutions | supports up to 16 EDSFF E1.L NVMe* SSDs. |
| Memory Specifications | |
| Max Memory Size (dependent on memory type) | 6 TB |
| Memory Types | -DDR4 (RDIMM) -3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules |
| Max # of Memory Channels | 16 |
| Max Memory Bandwidth | 204.8 GB/s |
| # of Memory Slots | 24 |
| ECC Memory Supported ‡ | Yes |
| Intel® Optane™ Persistent Memory Supported | Yes |
| Processor Graphics | |
| Integrated Graphics ‡ | Yes |
| Graphics Output | VGA |
| Expansion Options | |
| PCI Express Revision | 4 |
| Max # of PCI Express Lanes | 56 |
| PCIe OCuLink Connectors (NVMe support) | 8 |
| Riser Slot 1: Total # of Lanes | 32 |
| Riser Slot 2: Total # of Lanes | 24 |
| I/O Specifications | |
| # of USB Ports | 3 |
| USB Configuration | • One USB 3.0 port • Two USB 3.0 ports (dual-stack) |
| USB Revision | 3 |
| Total # of SATA Ports | 2 |
| Max # of UPI Links | 3 |
| RAID Configuration | 0/1/5 |
| # of Serial Ports | 1 |
| Integrated LAN | 1 |
| Package Specifications | |
| Max CPU Configuration | 2 |
| Advanced Technologies | |
| Advanced System Management key | Yes |
| Intel® Optane™ Memory Supported ‡ | Yes |
| Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | Yes |
| Intel® Node Manager | Yes |
| Intel® Advanced Management Technology | Yes |
| TPM Version | 2 |
| Security & Reliability | |
| Intel® AES New Instructions | Yes |
| Intel® Trusted Execution Technology ‡ | Yes |
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