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INNODISK EGPU-3201
Product Features
- Alternative M.2 2260 or 2280 BM key
- Compliant with PCI Express Base Specification Revision 2.0
- Compliant with USB 3.0 Specification Revision 1.0, up to 5Gbs
- Compliant with xHCI 1.0
- Supports 2 USB 3.0 ports (Share PCIe Gen2 x1 bandwidth)
- Supports each USB port output power up to 5V 900mawith external power in (200mA per port without external power)
- Complies with EN6100042 (ESD) Air15kV, Contact8kV
- Optional Industrial Temperature (40°C to +85°C) support
INNODISK EGPU-3201
Product Features
- Alternative M.2 2260 or 2280 BM key
- Compliant with PCI Express Base Specification Revision 2.0
- Compliant with USB 3.0 Specification Revision 1.0, up to 5Gbs
- Compliant with xHCI 1.0
- Supports 2 USB 3.0 ports (Share PCIe Gen2 x1 bandwidth)
- Supports each USB port output power up to 5V 900mawith external power in (200mA per port without external power)
- Complies with EN6100042 (ESD) Air15kV, Contact8kV
- Optional Industrial Temperature (40°C to +85°C) support
Order Information:
P/N | Description |
EGPU-3201-C1 | M.2 2260 to dual USB 3.0 Module |
EGPU-3201-C2 | M.2 2280 to dual USB 3.0 Module |
EGPU-3201-W1 | M.2 2260 to dual USB 3.0 Module W/T |
EGPU-3201-W2 | M.2 2280 to dual USB 3.0 Module W/T |
Module Name | EGPU-3201 |
Module Type | M.2 to dual USB 3.0 Module |
Form Factor | M.2 2260/2280 B-M |
Input I/F | PCI Express 2.0 |
Output I/F | USB 3.0 |
Output connector | 19 Pin header |
Power Consumption | MAX 1W (3.3V x 303mA) |
Dimensions (W x L x H/mm) | 22.0 x 60.0 x 8.4 | 22.0 x 80.0 x 8.4 |
Temperature | Operation: STD temp: 0°~70°C; W/T temp: -40°C ~ +85°C Storage: -55°C ~ +95°C |
Environment | Vibration: 5G @7~2000Hz Shock: 50G @ 0.5ms |
Notes | Please download driver from MyInnodisk website. Windows: XP(32 bit), 7(32/64 bit), Vista Linux: Kernel v2.6.0, v2.6.8 *After Win8 and Linux Kernel v2.6.31 supports built-in xHCI 1.0. |
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