Essentials |
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Product Collection |
Intel® Server D50TNP Family |
Code Name |
Products formerly Tennessee Pass |
Marketing Status |
Launched |
Launch Date |
Q2'21 |
Expected Discontinuance |
2023 |
EOL Announce |
Friday | May 5 | 2023 |
Last Order |
Friday | June 30 | 2023 |
Limited 3-year Warranty |
Yes |
Extended Warranty Available for Purchase (Select Countries) |
Yes |
Additional Extended Warranty Details |
Dual Processor Board Extended Warranty |
Compatible Product Series |
3rd Generation Intel® Xeon® Scalable Processors |
Board Form Factor |
8.33” x 21.5” |
Chassis Form Factor |
2U Rack |
Socket |
Socket-P4 |
Integrated BMC with IPMI |
IPMI 2.0 & Redfish |
Rack-Friendly Board |
Yes |
TDP |
270 W |
Included Items |
(1) Intel® Server Board D50TNP1SB (1) 2U full-width module tray – iPN K85397 (1) 2U accelerator module air duct – iPN K85780 (2) 2U PCIe Riser (Two x16 PCIe slots | M.2 Connector and U.2 Connector) TNP2URISER | with U.2 PCIe* NVMe* SSD adapter card included (2) 2U riser bracket to support TNP2URISER – iPN K25207 (2) 2.5” tool-less SSD drive carrier – iPN J36439 (2) M.2 heat sink assembly TNPM2HS (1) 2U Air-Cooled front Heat Sink TNP2UHSF (1) 2U Air-Cooled Rear Heat Sink TNP2UHSB (2) Processor clip | for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (1) 2U PCIe Accelerator Riser (two x16 PCIe slots) TNPACCLRISER1 (1) 2U PCIe Accelerator Riser (two x16 PCIe slots) TNPACCLRISER2 (1) Accelerator module power connector board – iPC TNPACCLNBRD (2) Power cable 110 mm to connect TNPACCLRISER1 and TNPACCLRISER 2 to TNPACCLNBRD – iPN K73519 (1 each) OCuLink cable 740 mm and 710 mm – iPN K87949 (2) OCuLink cable 260 mm – iPN K87954 |
Board Chipset |
Intel® C621A Chipset |
Target Market |
High Performance Computing |
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Supplemental Information |
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Embedded Options Available |
No |
Description |
A 2U high-density full-width Acceleration Module integrated with the Intel® Server Board D50TNP1SB intended to address acceleration solutions that support up to four 300 W PCIe* accelerator add-in cards. |
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Memory Specifications |
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Max Memory Size (dependent on memory type) |
6 TB |
Memory Types |
-DDR4 (RDIMM) -3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules |
Max # of Memory Channels |
16 |
Max Memory Bandwidth |
204.8 GB/s |
# of Memory Slots |
24 |
ECC Memory Supported ‡ |
Yes |
Intel® Optane™ Persistent Memory Supported |
Yes |
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Processor Graphics |
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Integrated Graphics ‡ |
Yes |
Graphics Output |
VGA |
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Expansion Options |
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PCI Express Revision |
4 |
Max # of PCI Express Lanes |
120 |
PCIe OCuLink Connectors (NVMe support) |
8 |
Riser Slot 1: Total # of Lanes |
32 |
Riser Slot 2: Total # of Lanes |
24 |
Riser Slot 3: Total # of Lanes |
32 |
Riser Slot 4: Total # of Lanes |
32 |
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I/O Specifications |
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# of USB Ports |
3 |
USB Configuration |
• One USB 3.0 port • Two USB 3.0 ports (dual-stack) |
USB Revision |
3 |
Total # of SATA Ports |
2 |
Max # of UPI Links |
3 |
RAID Configuration |
0/1 |
# of Serial Ports |
1 |
Integrated LAN |
1 |
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Package Specifications |
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Max CPU Configuration |
2 |
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Advanced Technologies |
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Advanced System Management key |
Yes |
Intel® Optane™ Memory Supported ‡ |
Yes |
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ |
Yes |
Intel® Node Manager |
Yes |
Intel® Advanced Management Technology |
Yes |
TPM Version |
2 |
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Security & Reliability |
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Intel® AES New Instructions |
Yes |
Intel® Trusted Execution Technology ‡ |
Yes |