SK hynix - DRAM - HBM - HBM3E

HBM3E Continues Leading the AI Market

SK hynix launched HBM3E to solidify it’s unrivaled leadership in AI memory market following its success with HBM3. The extended version of HBM3 helps accelerate business turnaround with its supply following industry’s largest scale of mass production of HBM.

10% Improved Thermal Resistance & Power Efficiency

SK hynix was the first to develop the MR-MUF (Mass Reflow-Molded Underfill) packing technology. This technique, which simultaneously bonds the chips together via reflow while filling the gaps with liquid material is significant in development of the highly thermal-conducive HBM. Together with technology on chip control, not only is wafer warpage prevented, but a new fill material was added to further better dissipate heat. Advanced MR-MUF has enhanced heat dissipation of HBM3E by 10% compared to the previous generation, while power efficiency has also improved by 10%.

x1.5 Capacity & Bandwidth with Same Package Size

HBM3E provides maximum capacity of 36GB and maximum per-pin data rate is 9.2Gbps, where maximum bandwidth exceeds 1.18TB per second, which is a 1.4times improvement compared to HBM3 both in terms of capacity and bandwidth.

The SK hynix HBM3E (High Bandwidth Memory 3 Enhanced) represents the latest innovation in memory technology, designed for high-performance computing (HPC) and artificial intelligence (AI) applications. Key features of the HBM3E include:

• Unprecedented Speed: It achieves a data transfer rate of 9.2 GT/s, a 40% improvement over its predecessor, HBM3. This results in a memory bandwidth of 1.15 TB/s per stack, capable of processing 230 Full HD movies (5GB each) in just one second​
• Advanced Manufacturing: Incorporates Advanced MR-MUF (Mass Reflow Molded Underfill) technology for improved thermal performance and enhanced stability​
• High Compatibility: Designed to integrate seamlessly with existing systems using prior generations of HBM memory, simplifying upgrades​
• AI and HPC Optimization: Specifically tailored for the needs of AI, machine learning, and deep learning, the HBM3E is ideal for systems requiring extensive parallel data processing​

Mass production of SK hynix HBM3E began in late 2024, solidifying its role in advancing AI memory technology and meeting the increasing demand for faster data handling in the computing industry​

For inquiries or purchasing SK hynix HBM3E, please contact:

• Hotline: 1900 0366
• Email: [email protected]
• SK products: https://dis.vdo.com.vn/vi/san-pham/sk-hynix-p206

VDO is an official distributor of SK hynix enterprise products in Vietnam.