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SK hynix - DRAM - HBM - HBM3
Density: 16-24GB
Speed: ~6.4Gbps (~819GB/s)
Package type: KGSD
Available Stack: 8,12Hi
Application
- Next-generation memory with reliability and performance gains
- Up to 819GB/s of bandwidth for resolution of memory bandwidth bottleneck
SK hynix - DRAM - HBM - HBM3
World’s First HBM3 Developed in October 2021
In just 15 months since launching HBM2E mass production, SK hynix solidified its leadership in high-speed DRAM by developing an HBM3, the latest in high-bandwidth memory for cutting-edge technologies across datacenters, supercomputers, and AI.
Advanced Thermal Dissipation
HBM3 runs at lower temperatures than HBM2E at the same level of operating voltage, enhancing stability of the server system environment. At equivalent operating temperatures, SK hynix HBM3 can support 12-die stacks or 1.5x capacity than HBM2E, and 6Gbps I/O speeds for 1.8x higher bandwidth. With greater cooling capacity for the same operating conditions thus, SK hynix delivers on its Memory ForEST* initiative.
Performance Boost
SK hynix HBM3, with 1.5x capacity than HBM2E from 12 DRAM die stacked to the same total package height, is fit to power capacity-intensive applications such as AI and HPC. A single cube can yield up to 819GB/s in bandwidth, while an SiP (System-in-Package) with six HBM chips on the same silicon can achieve up to 4.8TB/s in support of exascale demands.
On-die ECC
SK hynix HBM3 also features a robust and custom-designed on-die ECC (Error Correcting Code), which uses pre-allocated parity bits to check and correct errors in data received. The embedded circuitry allows DRAM to self-correct errors within cells, significantly enhancing device reliability.
Server Application:
Part No. | Density | KGSD Density | Speed | Package | Product Status |
H5UG7HME03X020R | 16Gb | 128Gb | 6.0Gbps | 8Hi | CS |
H5UG7HMD83X020R | 16Gb | 128Gb | 5.6Gbps | 8Hi | MP |
Applications:
- Artificial Intelligence (AI) and Machine Learning: Facilitates faster model training and inference, crucial for large-scale AI solutions.
- High-Performance Computing (HPC): Powers scientific research, weather modeling, and other compute-heavy tasks.
- Graphics and Gaming: Enhances performance in GPUs for cutting-edge graphics rendering and real-time ray tracing.
- Cloud and Data Centers: Supports cloud infrastructures with greater memory capacity and bandwidth.
Why Choose SK hynix HBM3?
SK hynix is a pioneer in DRAM innovation, and its HBM3 modules combine cutting-edge design with high reliability. This makes them a preferred choice for next-generation computing solutions that demand high bandwidth and low latency.
For procurement or technical details, consult SK hynix's official resources or their authorized distributors, such as VDO
For inquiries or purchasing SK hynix HBM3, please contact:
- Hotline: 1900 0366
- Email: [email protected]
- SK products: https://dis.vdo.com.vn/vi/san-pham/sk-hynix-p206
VDO is an official distributor of SK hynix enterprise products in Vietnam.
Density: 16-24GB
Speed: ~6.4Gbps (~819GB/s)
Package type: KGSD
Available Stack: 8,12Hi
Application
- Next-generation memory with reliability and performance gains
- Up to 819GB/s of bandwidth for resolution of memory bandwidth bottleneck
VDO Distributor - Nhà phân phối hạ tầng Công nghệ thông tin & Viễn thông hàng đầu Việt Nam
Website: vdo.com.vn
1900 0366
- Liên hệ tổng đài hoặc số điện thoại chi nhánh theo khu vực để nhận được tư vấn:
- Hà Nội: 024 7305 6666
- TP.HCM: 028 7308 6666
- Đà Nẵng: 0936300136