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SamSung HBM2 Aquabolt - 4GB
From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 4GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption form its predecessor HBM2 Flarebolt.
1.2TB/s astonishing speed
10x faster than GDDR5
Part number list:
KHA844801X-MC12
KHA844801X-MC13
KHA844801X-MN12
KHA844801X-MN13
SamSung HBM2 Aquabolt - 4GB
Accelerating the tech frontier
From next-generation supercomputing to AI and graphic intensive technologies, the state-of-the-art 8 GB HBM2 Aquabolt from Samsung is high-bandwidth memory meticulously designed to dramatically increase performance and reduce power consumption form its predecessor HBM2 Flarebolt.
Layers of powerful performance
With just four Aquabolt packages in a system, performance can reach an astounding speed of 1.2 TB/s.
With the 20% performance improvement over legacy HBM2 product, Aquabolt delivers the highest 1024 I/O with 2.4 Gbps per pin speed
at 1.2V - making it the fastest data transmission speed for DRAM performance currently available from Samsung.
This powerful 307.2 GB/s data bandwidth allows for a nearly 10x faster data transmission than the 8 Gb GDDR5 chip.
* Samsung HBM2 Flarebolt's performance: 2.0 Gbps at 1.35 V
* HBM2 - GDDR5 data transmission speed calculation
-8 GB HBM2 package's data bandwidth: 2.4 Gbps per pin x 1024 bit bus = 307.2 GBps
4 HBM2 package in a system: 307.2 GBps x 4 = 1228.8 GBps = approximately 1.2 TBps
-8 Gb GDDR5 die's data bandwidth: 8 Gbps per pin x 32 bit bus = 32 GBps
Optimized power efficiency
Enhanced to conserve energy, the innovative Aquabolt internal design reduces write power consumption by approximately 20%, interleave power by about 25% and read power usage by nearly 30% when compared to the previous generation.*
* Tested internally on the HBM2 Aquabolt and HBM2 Flarebolt
Enhanced reliability
To reinforce thermal control and endurance, each cube of Aquabolt includes more thermal bumps than the previous HBMs and a new protective bottom layer to safeguard against errors and data loss that can be caused by pressure, shock, and particles from direct contact.
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