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Intel® Server System D50TNP2MHSVAC Management Module
Essentials | |
Product Collection | Intel® Server D50TNP Family |
Chassis Form Factor | 2U Rack |
Compatible Product Series | 3rd Generation Intel® Xeon® Scalable Processors |
Socket | Socket-P4 |
TDP | 270 W |
Board Chipset | Intel® C621A Chipset |
Board Chipset | Intel® C741 Chipset |
Intel® Server System D50TNP2MHSVAC Management Module
Essentials | |
Product Collection | Intel® Server D50TNP Family |
Code Name | Products formerly Tennessee Pass |
Marketing Status | Launched |
Launch Date | Q2'21 |
Expected Discontinuance | 2023 |
EOL Announce | Friday | May 5 | 2023 |
Last Order | Friday | June 30 | 2023 |
Limited 3-year Warranty | Yes |
Extended Warranty Available for Purchase (Select Countries) | Yes |
Additional Extended Warranty Details | Dual Processor Board Extended Warranty |
Compatible Product Series | 3rd Generation Intel® Xeon® Scalable Processors |
Board Form Factor | 8.33” x 21.5” |
Chassis Form Factor | 2U Rack |
Socket | Socket-P4 |
Integrated BMC with IPMI | IPMI 2.0 & Redfish |
Rack-Friendly Board | Yes |
TDP | 270 W |
Included Items | (1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K53211 (1) 2U management module air duct – iPN K61939 (2) 2U PCIe Riser (Two x16 PCIe slots | M.2 Connector and U.2 Connector) TNP2URISER | with U.2 PCIe* NVMe* SSD adapter card included (2) 2U PCIe Riser (Two x16 PCIe slots | M.2 Connector and U.2 Connector) TNP2URISER (1) 2U Air-Cooled front Heat Sink TNP2UHSF (1) 2U Air-Cooled Rear Heat Sink TNP2UHSB (2) Processor clip | for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (2) M.2 heat sink assembly TNPM2HS (2) 2.5” tool-less SSD drive carrier – iPN J36439 |
Board Chipset | Intel® C621A Chipset |
Target Market | High Performance Computing |
Supplemental Information | |
Embedded Options Available | No |
Description | A 2U high-density Management Module integrated with the Intel® Server Board D50TNP1SB and up to 16 DDR4 DIMMs + up to 8 Intel® Optane™ persistent memory 200 series modules. |
Memory Specifications | |
Max Memory Size (dependent on memory type) | 6 TB |
Memory Types | -DDR4 (RDIMM) -3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules |
Max # of Memory Channels | 16 |
Max Memory Bandwidth | 204.8 GB/s |
# of Memory Slots | 24 |
ECC Memory Supported ‡ | Yes |
Intel® Optane™ Persistent Memory Supported | Yes |
Processor Graphics | |
Integrated Graphics ‡ | Yes |
Graphics Output | VGA |
Expansion Options | |
PCI Express Revision | 4 |
Max # of PCI Express Lanes | 56 |
PCIe OCuLink Connectors (NVMe support) | 8 |
Riser Slot 1: Total # of Lanes | 32 |
Riser Slot 2: Total # of Lanes | 24 |
I/O Specifications | |
# of USB Ports | 3 |
USB Configuration | • One USB 3.0 port • Two USB 3.0 ports (dual-stack) |
USB Revision | 3 |
Total # of SATA Ports | 2 |
Max # of UPI Links | 3 |
RAID Configuration | 0/1 |
# of Serial Ports | 1 |
Integrated LAN | 1 |
Package Specifications | |
Max CPU Configuration | 2 |
Advanced Technologies | |
Advanced System Management key | Yes |
Intel® Optane™ Memory Supported ‡ | Yes |
Intel® Virtualization Technology for Directed I/O (VT-d) ‡ | Yes |
Intel® Node Manager | Yes |
Intel® Advanced Management Technology | Yes |
TPM Version | 2 |
Security & Reliability | |
Intel® AES New Instructions | Yes |
Intel® Trusted Execution Technology ‡ | Yes |
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