Intel® Server System D50TNP2MHSVAC Management Module

Essentials
Product Collection	Intel® Server D50TNP Family
Chassis Form Factor	2U Rack
Compatible Product Series	3rd Generation Intel® Xeon® Scalable Processors
Socket	Socket-P4
TDP	270 W
Board Chipset	Intel® C621A Chipset
Board Chipset	Intel® C741 Chipset

Product Details
Specifications

Intel® Server System D50TNP2MHSVAC Management Module

Essentials
Product Collection	Intel® Server D50TNP Family
Code Name	Products formerly Tennessee Pass
Marketing Status	Launched
Launch Date	Q2'21
Expected Discontinuance	2023
EOL Announce	Friday \| May 5 \| 2023
Last Order	Friday \| June 30 \| 2023
Limited 3-year Warranty	Yes
Extended Warranty Available for Purchase (Select Countries)	Yes
Additional Extended Warranty Details	Dual Processor Board Extended Warranty
Compatible Product Series	3rd Generation Intel® Xeon® Scalable Processors
Board Form Factor	8.33” x 21.5”
Chassis Form Factor	2U Rack
Socket	Socket-P4
Integrated BMC with IPMI	IPMI 2.0 & Redfish
Rack-Friendly Board	Yes
TDP	270 W
Included Items	(1) Intel® Server Board D50TNP1SB (1) 2U half-width module tray – iPN K53211 (1) 2U management module air duct – iPN K61939 (2) 2U PCIe Riser (Two x16 PCIe slots \| M.2 Connector and U.2 Connector) TNP2URISER \| with U.2 PCIe* NVMe* SSD adapter card included (2) 2U PCIe Riser (Two x16 PCIe slots \| M.2 Connector and U.2 Connector) TNP2URISER (1) 2U Air-Cooled front Heat Sink TNP2UHSF (1) 2U Air-Cooled Rear Heat Sink TNP2UHSB (2) Processor clip \| for 3rd Gen Intel® Xeon® Scalable processor family – iPN J98484 (2) M.2 heat sink assembly TNPM2HS (2) 2.5” tool-less SSD drive carrier – iPN J36439
Board Chipset	Intel® C621A Chipset
Target Market	High Performance Computing

Supplemental Information
Embedded Options Available	No
Description	A 2U high-density Management Module integrated with the Intel® Server Board D50TNP1SB and up to 16 DDR4 DIMMs + up to 8 Intel® Optane™ persistent memory 200 series modules.

Memory Specifications
Max Memory Size (dependent on memory type)	6 TB
Memory Types	-DDR4 (RDIMM) -3DS-RDIMM -Load Reduced DDR4 (LRDIMM) -3DS-LRDIMM -Intel® Optane™ persistent memory 200 series modules
Max # of Memory Channels	16
Max Memory Bandwidth	204.8 GB/s
# of Memory Slots	24
ECC Memory Supported ‡	Yes
Intel® Optane™ Persistent Memory Supported	Yes

Processor Graphics
Integrated Graphics ‡	Yes
Graphics Output	VGA

Expansion Options
PCI Express Revision	4
Max # of PCI Express Lanes	56
PCIe OCuLink Connectors (NVMe support)	8
Riser Slot 1: Total # of Lanes	32
Riser Slot 2: Total # of Lanes	24

I/O Specifications
# of USB Ports	3
USB Configuration	• One USB 3.0 port • Two USB 3.0 ports (dual-stack)
USB Revision	3
Total # of SATA Ports	2
Max # of UPI Links	3
RAID Configuration	0/1
# of Serial Ports	1
Integrated LAN	1

Package Specifications
Max CPU Configuration	2

Advanced Technologies
Advanced System Management key	Yes
Intel® Optane™ Memory Supported ‡	Yes
Intel® Virtualization Technology for Directed I/O (VT-d) ‡	Yes
Intel® Node Manager	Yes
Intel® Advanced Management Technology	Yes
TPM Version	2

Security & Reliability
Intel® AES New Instructions	Yes
Intel® Trusted Execution Technology ‡	Yes